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Home > Discontinued > Rackmount Servers > Intel

Rackform iServ R237

The Rackform iServ R237 1U Intel® Dual-Core Xeon® LV Server brings Intel's next-generation 65-nm, power-optimized technology to the volume server market. Supporting up to two 32-bit Intel low-voltage Xeon processors with a 31W-per-processor power envelope, 667MHz Front Side Bus, 16GB of DDR2 memory, dual GigE adapters, and 4 hot-swap SATA drives, this RAID-ready 1U Dual-Core Xeon LV Server is an excellent choice in today's power-starved, space-constrained data center.


Please see one of our 1U Dual Xeon® Servers:
Rackform iServ R253 or the Rackform iServ R256

Technical Specs
Hardware Specifications Intel® Xeon® LV Processor Highlights  
 

System

CPU
  • Dual 479-pin Sockets
  • Supports Dual Intel® Xeon® LV Processors
Chipset
  • Intel® E7520 chipset
  • 667MHz System Bus

Memory

Memory Capacity
  • Eight 240-pin DIMM sockets
  • Supports up to 16 GB DDR2-400 registered ECC memory
  • Memory must be populated in pairs
Memory Type
  • DDR2-400 registered ECC SDRAM 72-bit

Error Detection
  • Corrects single-bit errors (ECC)
  • Detects double-bit errors (ECC)

Storage

SATA Interfaces
  • Intel® 6300ESB SATA controller
  • 2 x SATA Interfaces
  • RAID 0, 1 support (Microsoft® Windows™ only)
PATA Interfaces
  • 2 UATA/100 EIDE Channels, supports 4 Devices
Drive bays
  • 4 x 3 1/2" SAS/SATA swappable drive bays

Network

Integrated Interfaces
  • 2 x Intel® PCI-Express Gigabit ports

Management

Features
  • Serial Console Re-direction
  • Optional IPMI (Intelligent Platform Management Interface) 2.0
  • Watch Dog
  • NMI

    Peripheral Drives

    Floppy
    • 1.44MB
      CD/DVD/RW
      • Slimline DVD, or DVD +/- RW

      Input/Output

      Graphics
      • ATI Rage XL SVGA PCI video controller with 8 MB of video memory
      USB
      • 2 x USB 2.0 ports (rear panel)
      • Optional 2 x USB 2.0 ports (front panel)
      Serial Ports
      • 1 x Fast UART 16550 serial port (rear panel)
      • Optional 1 x Fast UART 16550 serial port (front panel)
      KB/Mouse
      • PS/2 keyboard and mouse ports (rear panel)

      Expansion Slots

      PCI
      • 1 x PCI-X 66MHz/64-Bit
      • 1 x PCI-Express x8
      		  

      Front Panel

      Buttons and Switches
      • Power button
      • Reset button
      LEDs
      • Power LED
      • Hard Drive LED
      • NIC 1 Activity
      • NIC 2 Activity
      • Overheat LED

      Back Panel

      Power Receptacle
      • IEC-320 C14 AC

      Chassis

      Form Factor
      • 1U rackmount chassis
      Height
      • 43 mm, 1.7"
      Width
      • 437 mm, 17.2"
      Depth
      • 503 mm, 19.8"
      Color
      • Black face, Plated Metal body
      Rack Support
      • Compatible with four-post or two-post racks
      • Min post depth: 25 3/4"
      • Max post depth: 33 1/2"
      • Min enclosure depth: 28"

      Power

      Power Supply
      • 300W AC power supply with PFC
      AC Voltage
      • 100 – 240V, 50/60Hz

      Environment

      Ambient Temperature
      • Operating: 10°C to +35°C; non-operating: -40°C to +60°C
      Relative Humidity
      • Operating: 8–90% non-condensing; Non-operating: 5–95% non-condensing

      Safety/Regulatory Compliance (Power Supply)

      United States
      • UL Listed, FCC
      Canada
      • cUL listed
      Europe, CE Mark
      • EN60950 (complies with73/23/EEC)
      International
      • EN 60950/IEC 60950 Compliant
       
      Feature Benefit
      Two low-power cores per processor Significant performance headroom at low power for multi-threaded applications
      Demand-Based Switching (DBS) with Enhanced Intel SpeedStep® technology Enables platform and software power management features to help lower average power consumption while maintaining application performance and improving acoustics
      2-MB integrated L2 cache More data can be stored closer to processor execution units for faster data access, resulting in higher system throughput and shorter system latency
      Up to 2x performance/watt Allows rack-optimized solutions in ultra-dense deployments and reduces power/thermal and space constraints in data centers
      Support for DDR2-400 memory • Provides up to 20% increase in memory bandwidth over DDR-333
      • Up to 30 to 40% lower power consumption vs. DDR-333
      • Increased DIMMs per system for enhanced memory scalability
      Supports up to 16 GB of memory Access large data sets with 32-bit computing
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      Copyright © 2012 Silicon Mechanics

      Silicon Mechanics and the Silicon Mechanics logo are registered trademarks of Silicon Mechanics, Inc.
      Intel, the Intel logo, Xeon, and Xeon Inside, are trademarks or registered trademarks of Intel Corporation in the US and other countries.
      All other trademarks are the property of their respective owners.