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Home > Hyperform HPC

Hyperform HPCg R3501
HPCg R3501 Tesla™ preconfigured Cluster with Intel® Xeon® 5500 Series processors will deliver supercomputing performance at lower power and lower cost, using fewer systems than standard CPU-only clusters. The HPCg R3501 is powered by the R350-GPU server, up to 1.9-teraflop single precision performance 1U system based on NVIDIA® CUDA™ parallel computing architecture. The R3501 speeds the transition to energy-efficient parallel computing and scales to solve the world's most important computing challenges more quickly and accurately.

The default configuration includes R346 Head Node with two R350-GPU Compute nodes, integrated with two Tesla™ GPU in each compute node. This also includes ROCKS+ licenses which adds vastly expanded solution layer and enterprise-class support.

The turnkey 24U system configured below is also available in 12u rack and a 42u rack.


   
System Price:  $14444.00  
Configure Technical Specs
Head Node: Rackform iServ R346 Compute Node: Rackform iServ R350-GPU C1060 GPU
 

System

CPU
  • Dual 1366-pin LGA sockets
  • Supports 2 Intel® Xeon® 5500 Series processors (QPI up to 6.4 GT/s)
Chipset
  • Intel® 5520 (Tylersburg)
  • ICH10R + IOH-36D

Memory

Memory Capacity
  • Twelve 240-pin DDR3 DIMM sockets
  • Supports up to 96 GB 1333 / 1066 / 800MHz DDR3 ECC Registered memory
  • Supports up to 24 GB 1333 / 1066 / 800MHz DDR3 ECC Unbuffered memory
  • Memory mirroring supported
Memory Type
  • 1333 / 1066 / 800MHz Registered / ECC Unbuffered DDR3 SDRAM 72-bit, 240-pin gold-plated DIMMs
DIMM Sizes
  • 1GB, 2GB, 4GB, 8GB
Memory Voltage
  • 1.5 V
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
  • Supports Intel® x4 and x8 Single Device Data Correction (SDDC)

Integrated Devices

Chipset
  • Intel® 5520 (Tylersburg) chipset
  • ICH10R + IOH-36D
SATA
  • Intel ICH10R SATA 3.0Gbps Controller
  • RAID 0, 1, 5, 10 support
SAS (optional)
  • LSI SAS1068E
  • RAID 0, 1, 10 support
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
  • Winbond® WPCM450 BMC
Network Controllers
  • Intel® 82576 Gigabit Ethernet Controller
  • Supports 10BASE-T, 100BASE-TX, and 1000BASE-T, RJ45 output
  • Intel® I/OAT 3 support
  • VMDq support
  • 1 Realtek RTL8201N PHY (dedicated IPMI)
Graphics
  • Matrox G200eW
Super I/O
  • Winbond® 83827HF chip

Input / Output

SAS (Optional)
  • 8 SAS / SATA ports
Serial ATA
  • Six Serial ATA ports
  • Six SATA hard drives supported
Floppy
  • 1 Floppy controller; 1.44 MB
LAN
  • 2 RJ45 LAN ports
  • 1 RJ45 Dedicated IPMI LAN port
USB
  • 4 USB rear ports
  • 2 USB on-board
  • 4 USB internal headers
  • Total 8 USB 2.0 Compliant
VGA
  • 1 VGA Port
Serial Port / Header
  • 1 x Fast UART 16550 serial port
  • 1 x Fast UART 16550 serial header (option)
KB / Mouse
  • PS/2 keyboard and mouse ports
  

Storage

Hot-Swap Drives
  • 8 x 3.5" SAS / SATA hot-swap drive bays
Fixed Drive
  • 2 x 3.5" fixed SATA drives
  • OR 1.44MB floppy drive and 3.5" fixed SATA drive

Management

Software
  • IPMI (Intelligent Platform Management Interface) v1.5 / 2.0 with KVM support
  • Super Doctor III
Power Configurations
  • ACPI / ACPM Power Management

Peripheral Drives

Optical Media
  • Slim DVD-ROM drive (optional)
Floppy Drive
  • Slim floppy drive (optional)

Expansion Slots

Low-Profile PCIe
  • 3 x PCIe 2.0 x8
  • 1 x PCIe x4
Low-Profile PCI
  • 2 x 33MHz PCI

Front Panel

Buttons
  • Power button
  • Reset button
LEDs
  • Power
  • Hard Drive
  • NIC 1 Activity
  • NIC 2 Activity
  • Overheat
  • Power Fail

Back Panel

Power Receptacle
  • IEC-320 C14 AC

Chassis

Form Factor
  • 2U rackmount chassis
Height
  • 89 mm, 3.5"
Width
  • 437 mm, 17.2"
Depth
  • 648 mm, 25.5"
Chassis Weight
  • 52 lbs (23.59 kg)

Power

Power Supply
  • Redundant 720W AC Power Supply with PMBus
AC Input
  • 100–240 V, 50–60 Hz, 4–9 Amp
DC Output
  • 3 Amp @ +5V standby
  • 59 Amp @ +12V

Environment

Ambient Temperature
  • Operating: 10°C to 35°C; non-operating: -40°C to 70°C
Relative Humidity
  • Operating: 8–90% non-condensing; Non-operating: 5–95% non-condensing

Safety / Regulatory Compliance (Power Supply)

United States
  • UL Listed, FCC
Canada
  • cUL listed
Europe
  • EN 60950/IEC 60950-Compliant
Germany
  • TUV Certified
International
  • CB Report
 

System

CPU
  • Dual 1366-pin LGA sockets
  • Supports 2 Intel® Xeon® 5500 Series processors (QPI up to 6.4 GT/s)
Chipset
  • Intel® 5520 (Tylersburg)
  • ICH10R + IOH-36D

Memory

Memory Capacity
  • Twelve 240-pin DDR3 DIMM sockets
  • Supports up to 96 GB 1333 / 1066 / 800MHz DDR3 ECC Registered memory
  • Supports up to 24 GB 1333 / 1066 / 800MHz DDR3 ECC Unbuffered memory
  • Memory mirroring supported
Memory Type
  • 1333 / 1066 / 800MHz ECC Registered / ECC Unbuffered DDR3 SDRAM 72-bit, 240-pin gold-plated DIMMs
DIMM Sizes
  • 1GB, 2GB, 4GB, 8GB
Memory Voltage
  • 1.5 V
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
  • Supports Intel® x4 and x8 Single Device Data Correction (SDDC)

Integrated Devices

Chipset
  • Intel® 5520 (Tylersburg) chipset
  • ICH10R + IOH-36D
SATA
  • Intel ICH10R SATA 3.0Gbps Controller
  • RAID 0, 1, 5, 10 support
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
  • Winbond® WPCM450 BMC
Network Controllers
  • Intel® Dual-Port 82576 Gigabit Ethernet Controller
  • Supports 10BASE-T, 100BASE-TX, and 1000BASE-T, RJ45 output
  • Intel® I/OAT 3 support
  • VMDq support
  • Realtek RTL8201N PHY (dedicated IPMI)
Graphics
  • Matrox G200eW 8 MB DDR2
Super I/O
  • Winbond W83527HG chip

Input / Output

Serial ATA
  • 6 Serial ATA ports
  • 6 SATA hard drives supported
LAN
  • 2 x RJ45 LAN ports
  • 1 x RJ45 Dedicated IPMI LAN port
USB
  • 2 USB rear ports
  • 1 header USB port
  • Total 4 USB 2.0 compliant / 1.1 compliant
VGA
  • 1 VGA Port
Serial Port / Header
  • 1 x Fast UART 16550 serial port

Storage

Hot-Swap Drives
  • 3 x 3.5" SAS/SATA hot-swap drive bays
  

Management

IPMI
  • Support for IPMI (Intelligent Platform Management Interface) 2.0 with virtual media over LAN and KVM-over-LAN support
  • Winbond® WPCM450 BMC

Expansion Slots

Low-Profile PCIe
  • 1 PCIe 2.0 x4 (in x16 slot)
  • 2 PCIe 2.0 x16 (1 on each side, for GPUs)

Front Panel

Buttons
  • Power button
  • Reset button
LEDs
  • Power
  • Hard Drive
  • NIC 1 & 2 Activity
  • Overheat
  • Fan Fail
  • Power Fail
  • UID LED

Chassis

Form Factor
  • 1U rackmount
Height
  • 43 mm, 1.7"
Width
  • 437 mm, 17.2"
Depth
  • 716 mm, 28.2"
Chassis Weight
  • 38 lbs (17.2 kg)

Power

Power Supply
  • High-efficiency 1400W AC Power Supply with PMBus
  • 80 PLUS certified
AC Input
  • 1200W: 100 – 140V, 50 – 60Hz, 10.5 – 14.7 Amp
  • 1400W: 180 – 240V, 50 – 60Hz, 7.2 – 9.5 Amp
DC Output +5V standby
  • 4 Amp
DC Output +12V
  • 100 Amp @ 100-140V
  • 116 Amp @ 180-240V

Environment

RoHS
  • RoHS Compliant
Ambient Temperature
  • Operating: 10°C to 35°C; non-operating: -40°C to 70°C
Relative Humidity
  • Operating: 8–90% non-condensing; Non-operating: 5–95% non-condensing

Safety / Regulatory Compliance (Power Supply)

United States
  • UL Listed, FCC
Canada
  • CUL listed
Europe
  • EN 60950/IEC 60950-Compliant
  • Europe/CE Mark
Germany
  • TUV Certified
 

GPU

  • 240 processor cores
  • Supports up to four NVIDIA® Tesla™ C1060 units
  • 1.296 GHz processor clock
  • Voltage: 1.1875 V

Floating Point Performance

  • Single precision – 933 Gigaflops
  • Double precision – 78 Gigaflops
  

BIOS

  • 32Mb SPI Flash EEPROM with AMI® BIOS

Board

  • 14-layer printed circuit board
  • PCI Express 2.0 x 16 system interface
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