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Home > Rackform Rackmount Servers > 3U & Larger Servers

Rackform iServ R450

The Rackform iServ R450 4U Quad Xeon® Server features 4 Six-Core or Quad-Core Intel® Xeon® processors MP 7400, 7300, or 7200 series with 1066MHz System Bus and Intel Virtualization Technology. The iServ R450 supports up to 32 Fully Buffered DIMMs, integrated dual or quad Gigabit Ethernet ports, 8 hot-swap 2.5" SAS drive bays, redundant power supply, and 7 PCIe slots. With multiple levels of server management, this 4U Quad Xeon Server is a powerful choice for enterprise-critical functions.

System Price:  $9646.00  
Warranty   $121.00  
Configure Technical Specs Technical Support

System

CPU
  • Supports up to 4 Six-Core Intel® Xeon® processors 7400 series
  • Supports up to 4 Quad-Core Intel® Xeon® processors 7300 series
  • Supports up to 4 Dual-Core Intel Xeon processors 7200 series
Chipset
  • Intel® 7300 Chipset

Memory

Memory Capacity
  • Supports up to 256 GB (up to 32 DIMM sockets) on up to four memory expansion boards
Memory Type
  • Registered ECC Fully Buffered DDR2-533 / 667 SDRAM 72bit, 240-pin DIMMs
  • Supports 512MB, 1GB, 2GB, 4GB, 8GB sizes
  • 1.8 volt only
Error Detection
  • ECC memory support to correct single-bit errors and detect multiple-bit errors
Memory Sparing
  • Supports memory sparing and mirroring

Drives

Drive Bays
  • 8 x 2.5" hot-swap SAS / SATA drive bays
DVD Drive
  • DVD-ROM / CD-ROM drive

Network

Integrated Interfaces
  • Intel® 82563EB dual-port Gigabit Ethernet controller with Intel® I/O Acceleration Technology (I/OAT)
  • Intel 82575EA dual-port Gigabit Ethernet controller with Intel® I/OAT (via Network I/O Expansion Module)

Cooling

System Cooling Front
  • Two front hot-swap variable-speed fan modules
System Cooling Rear
  • Four rear hot-swap variable-speed fan modules

Integrated Onboard / Optional Modules

Graphics
  • ATI ES1000 PCI graphics controller, 1600 x 1200 maximum resolution
Trusted Platform Module (TPM)
  • Trusted Computing Group™ TPM Specification 1.2 compliant
SAS Controller (Riser) & RAID Activation Key
  • Intel® Integrated RAID Module
  • HW RAID support for RAID 0, 1, 1A, 5, 6, 10, 50, 60
RMM2 (Riser + Module)
  • RMM2 KVM and Media connectivity One 10/100 MB RJ-45

Input / Output

PCI
  • 4 x PCIe x8 (two slots hot-plug)
  • 3 x PCIe x4
USB
  • Five USB 2.0-compatible connectors (two rear, three front access)
Serial Ports
  • One rear DB9 9-pin connector
Video Port
  • One rear and one front standard VGA-compatible 15-pin connector
LAN Port
  • Quad Gigabit Ethernet connections

Intel® Server Management

Integrated Management Type
  • Onboard platform instrumentation
Software Support
  • Intel® System Management Software 2.0
  • Microsoft System Center Essentials (SCE) 2007
  • Intel® Deployment Assistant v1.4
Remote Management
  • Intel® Remote Management Module 2
System Monitoring and Auto-Recovery
  • System health indicators and corrective actions including automated power cycling, OS watchdog timer, and fault-resilient booting
Server Troubleshooting
  • Intel® Light-Guided Diagnostics, continuous health monitoring, text console redirection, and error logs
Intelligent Platform Management
  • Intelligent Platform Management Interface (IPMI) 2.0
  

Front Panel

LED
  • System identification
  • System power / sleep indicator
  • NIC 1 activity
  • NIC 2 activity
  • Hard drive activity
  • System fault
Standard Control Panel
  • Recessed NMI button
  • System reset button
  • System power button
  • Chassis ID button
Optional LCD Control Panel
  • Directional navigation
  • Supports some IPMI functionality via IPMB (Intelligent Platform Management Bus)

Chassis

Form Factor
  • 4U rackmount chassis
Height
  • 173 mm, 6.8"
Width
  • 447 mm, 17.6"
Depth
  • 706 mm, 27.8"
Color
  • Black front plate, plated metal body
Rail Kit
  • Compatible with four-post racks
  • Min Post Depth: 705 mm, 27.75"
  • Max Post Depth: 914 mm, 36"
  • Min enclosure depth: 813 mm, 32"

Power

Power Supply
  • Hot-swappable 110 / 220V, 1570W power supply modules, for 1 + 1 redundant power

Environment

Ambient Temperature
  • Operating: 10° C to 35° C
  • Non-operating: -40° C to 70° C
Relative Humidity
  • Non-operating: 95%, non-condensing at 25° to 30° C
Acoustics
  • Sound pressure: < 55dBA at ambient temperatures < 23° C, measured at bystander positions operating mode
  • Sound Power: < 7.0dBA at ambient temperatures < 23° C, measured using Dome Method in operating mode
Electrostatic Discharge
  • Tested up to 15 kV air discharge and up to 8 kV contact discharge without physical damage per Intel test specification

Safety and Regulatory Compliance (Class A)

Argentina
  • IRAM
Australia / New Zealand
  • ACA, MED
Belarus
  • Bellis
Canada
  • UL / Industry Canada
China
  • CNCA
Europe
  • European Directives
Germany
  • GS
International
  • CB Report / CISPR
Japan
  • VCCI
Korea
  • RRL
Russia
  • GOST
Taiwan
  • BSMI RPC
United States
  • UL / FCC
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Silicon Mechanics and the Silicon Mechanics logo are registered trademarks of Silicon Mechanics, Inc.
Intel, the Intel logo, Xeon, and Xeon Inside, are trademarks or registered trademarks of Intel Corporation in the US and other countries.
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